Apple’s New Performance Cores Within The M5 Pro Chip Are Outcompeting Similar Cores Within Intel’s Panther Lake Chips Rohail Saleem • at EDT Add on Google This would explain the slightly increased CPU core count and incredibly fast single-core and multi-core performance Apple silicon has truly come of age, and if any skeptic still requires an incontrovertible proof, look no further than the performance cores within the new M5 Pro chips, which are now going toe-to-toe with similar cores within Intel's Panther Lake chips, but at a fraction of their overall power draw. The SPEC integer rate metric shows the Apple M5 Pro chip's performance cores go toe-to-toe with similar cores within Intel's Panther Lake chips, while being incredibly efficient For the benefit of those who might not be aware, Apple introduced a new fusion architecture with its M5 Pro and M5 Max chips, one that is based on chiplets. This architecture leverages TSMC's SoIC 3D packaging solution, facilitating the integration of multiple individual dies - such as the CPU, GPU, and the Neural Engine - onto a single package, which provides for an unprecedented level of flexibility due to the sheer number of die configurations that then become available. Related Story Apple All Set To Consume 2.4 Exabytes Of LPDDR5 Memory This Year Even As DRAM Costs ExplodeThe new M5 Pro and Max chips have also introduced new Super cores and Performance cores (or P-cores), which have now replaced the Efficiency cores within this new architecture. As we noted previously, these Performance cores are entirely different from the Super and Efficiency cores, featuring a completely redesigned microarchitecture. According to jht5132, the M5 Pro's P-core (not the super core) matches Intel's Panther Lake P-core in SPEC integer rate performance while being incredibly efficient at 2.5W/4.38GHz. Apple coming up with a 'super core' wasn't a marketing stunt it was just being accurate. pic.twitter.com/sCAQMKy3Ju— INIYSA (@lafaiel) April 16, 2026 This brings us to the core of today's topic. The SPEC integer rate test holistically measures the performance of a computer per unit of time, based on integer workloads. According to a recent SPEC integer rate test by jht5132, the M5 Pro's Performance core matches the results obtained by the similar core on an Intel Panther Lake chip, while consuming just 2.5W of power (clocked at 4.38GHz). This is a striking result, especially as the Performance core within the M5 Pro/Max is delivering around 70 percent of the Super core's performance. About the : Writing is my one incontrovertible passion. Over the past six years, he has authored over 2,200 distinct articles on financial and tech-related topics, spanning nearly 1 million words. And he has been a member of Wcctech mobile team since 2025. As an alumnus of the University of Toronto, Rotman Commerce Program, I bring nuance, in-depth knowledge, and a unique perspective to every topic that I cover. When I'm not writing, I'm traveling the world, exploring hidden confectionaries and restaurants as an aspiring food connoisseur. Follow on Google to get more of our news coverage in your feeds. Further Reading A Crucial iPhone 18 Pro Component Enters Production And It Could Become A Major Selling Point For Millions Later This Year Apple Leaves Major Clue In Its Latest MacBook Neo Ad, Hinting How Exceptionally Well The Company’s Most Affordable Notebook Is Selling Daishin Securities: Apple Is Hoarding Memory To Sabotage Competition, Creating Panic Among Chinese OEMs Apple To Observe A Price Freeze On iPhone 18 Pro To Gain Massive Edge Over Rivals, But At The Expense Of Offering Fewer Options To Buyers Read all on Apple’s New Performance Cores Within The M5 Pro Chip Are Outcompeting Similar Cores Within Intel’s Panther Lake Chips
16 Apr 2026, 06:50 PM
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Key takeaways
- Apple’s New Performance Cores Within The M5 Pro Chip Are Outcompeting Similar Cores Within Intel’s Panther Lake Chips Ro...
- The SPEC integer rate metric shows the Apple M5 Pro chip's performance cores go toe-to-toe with similar cores within Int...
- This architecture leverages TSMC's SoIC 3D packaging solution, facilitating the integration of multiple individual dies...
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