Imec has taken delivery of the world’s most advanced high numerical aperture (NA) extreme ultraviolet (EUV) lithography system from ASML, the EXE:5200. This deployment solidifies imec’s role as a front-runner in semiconductor innovation, providing industry partners with early access to next-generation patterning technologies critical for sub-2nm logic and memory production.

The EXE:5200 is designed to push the boundaries of chip scaling, offering unmatched resolution, improved overlay precision, and higher throughput. Its integration into imec’s 300mm cleanroom in Leuven, Belgium, will enable faster development cycles for advanced AI and high-performance computing applications. The system also introduces a new wafer stocker, enhancing process stability and efficiency—a key factor as the industry transitions to smaller node technologies.

This milestone is part of imec’s five-year partnership with ASML, supported by the EU, Flemish government, and Dutch government. The collaboration aims to strengthen Europe’s position in semiconductor research while addressing the growing demand for sub-2nm chip technologies. Imec expects full qualification of the EXE:5200 by late 2026, though ongoing R&D will continue at ASML’s High NA EUV Lithography Lab in Veldhoven.

T-Force Delta RGB DDR5 memory modules on vibrant yellow surface.

The system’s capabilities extend beyond traditional lithography, offering a decisive advantage for chip manufacturers targeting sub-2nm nodes. With improved performance and scalability, it is poised to become a cornerstone in the development of next-generation logic and memory devices. Meanwhile, ASML remains focused on extending High NA EUV technology to meet future demands for advanced computing.

While the EXE:5200 represents the current state-of-the-art, questions remain about its long-term scalability. The system’s ability to handle 1nm nodes and beyond will be critical in determining its lasting impact on semiconductor roadmaps. For now, imec’s deployment ensures that industry partners gain early access to these advanced patterning techniques, setting the stage for breakthroughs in AI and high-performance computing.