Industry SK Hynix’s Former CEO Returns to Intel After Years Away, Taking Charge as EVP of Foundry Business & Advanced Packaging Technologies Hassan Mujtaba • at EDT Add on Google Intel has hired Seok-Hee Lee as EVP of its Foundry's Advanced Packaging & Back-End Technology, bringing years of experience from SK Hynix, where he served as President and CEO. Intel Foundry Gets SK Hynix's Ex-CEO, Seok-Hee Lee, Bringing Years of Experience In The Advanced Packaging & Back-End Technology Segment Press Release: Intel Corporation today announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan. In this role, Lee will lead all advanced packaging, system integration, back-end technology development, and back-end manufacturing, strengthening Intel’s ability to deliver differentiated, system-level innovation for customers. Related Story Report: Intel Partners With Taiwan’s UMC on 3nm Chips, Taking Direct Aim at TSMC’s Foundry Dominance Seok-Hee Lee joins Intel as EVP, @Intel_Foundry, to lead advanced packaging and back-end manufacturing, strengthening our ability to deliver system-level innovation. Naga Chandrasekaran will continue to lead front-end technology development, manufacturing, design enablement,… pic.twitter.com/tBGYZpk7oz— Intel (@intel) June 18, 2026 Seok-Hee Lee Appointed to Lead Advanced Packaging As part of the continued evolution of the Intel Foundry strategy, the company is establishing advanced packaging as a focused business with dedicated leadership. This reflects the growing importance and complexity of packaging as a key enabler of performance, power efficiency, and heterogeneous integration across AI systems. “Advanced packaging and system integration are becoming defining capabilities for next-generation computing systems,” said Lip-Bu Tan, Intel CEO. “Seok-Hee brings deep expertise in leading complex, high-scale technology and manufacturing organizations, along with a strong track record of operational execution. Seok-Hee’s insights will help Intel further strengthen our system integration capabilities, allowing us to tightly couple leading-edge logic, memory, networking, and other components to build high-performance computing systems for Intel Foundry customers. He is the right leader to build and scale this critical part of the Intel Foundry business as we prepare to ramp advanced packaging technologies, including EMIB-T and HBI, to high volume for customers and partners.” Image Source: Intel Lee joins Intel from SK On, where he served as president and CEO, and previously served as president and CEO of SK hynix. A semiconductor veteran, he has also held engineering leadership roles at Intel and in academia, bringing deep expertise in advanced process technologies and large-scale manufacturing. “Intel is uniquely positioned to lead in advanced packaging as demand for system-level integration accelerates across AI and high-performance computing,” said Lee. “I’m excited to return home and to join the Intel team as we help advance the company’s technology leadership, manufacturing capabilities, and customer commitments in this critical area.” With this change, Naga Chandrasekaran, executive vice president of Intel Foundry, will continue to report to CEO Lip-Bu Tan and lead front-end technology development and front-end manufacturing as the company focuses on accelerating the ramp of Intel 18A, Intel 14A, and future technologies. He will also continue to oversee design enablement and end-to-end customer-facing and business enablement functions that support Intel Foundry’s growth. This new, focused, and scalable operating model reinforces Intel’s commitment to strengthening its technology development and manufacturing engine, giving customers and partners greater confidence in Intel’s ability to deliver with speed, consistency, and predictability. As part of the announcement, Intel also shared that executive vice president Navid Shahriari will be retiring after a distinguished 37-year career at the company. About the : A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as 's for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking. Follow on Google to get more of our news coverage in your feeds. Further Reading Apple To Design & Build Chips At Intel on American Soil, US President Confirms Lip-Bu Tan Nearly Walked Away From Semiconductors, But One Plea to ‘Save Intel’ Pulled Him Back as CEO, Now Hiring Top CPU/GPU Architects The Future Of EUV: ASML’s Plans For The Hyperscale Era Intel’s 18A-P Debuts Power Boost, an Industry-First Dual-Contact Transistor That Squeezes More Frequency From the Same Chip Footprint Read all on SK Hynix’s Former CEO Returns to Intel After Years Away, Taking Charge as EVP of Foundry Business & Advanced Packaging Technologies
