In the crowded world of workstation GPUs, MaxSun has carved out a niche with its dual-GPU Arc Pro B60 lineup. The latest addition—a single-slot liquid-cooled variant—pushes the boundaries of thermal efficiency in dense computing setups.

The new model packs two Intel Arc Pro B60 GPUs into a 300 x 110 x 20 mm profile, fitting neatly into a single PCIe slot. This isn't just about saving space; it's about redefining how GPUs operate in high-density enclosures where airflow is limited. Traditional multi-GPU setups often require bulky designs to manage heat, but this liquid-cooled iteration keeps peak temperatures around 61°C when integrated into a cooling loop—without the need for strong airflow.

Performance-wise, the card maintains a TDP of 400 W, similar to its passive and fan-equipped counterparts. However, liquid cooling introduces a stability boost, allowing sustained performance in environments where thermal throttling is a concern. The compact design isn't just theoretical; it's a practical solution for workstations where multiple GPUs are crammed into tight spaces.

  • Two Intel Arc Pro B60 GPUs with 48 GB GDDR6 memory and 40 Xe2 cores each.
  • Single-slot liquid-cooled design, ideal for dense enclosures.
  • Peak GPU temperatures around 61°C in a cooling loop.
  • Four display outputs: two DisplayPort 1.2 and one HDMI 2.1a per GPU.

The collaboration with abee highlights MaxSun's focus on innovation, particularly in thermal management. The liquid-cooled variant isn't just about temperature control; it's about enabling closer GPU stacking without the need for high-airflow cases or complex cooling setups. This is a game-changer for AI inference and local development workloads, where multiple GPUs are often required but space is limited.

For gamers and professionals alike, this design means more compute power in less space—without the usual trade-offs of heat or performance. Whether it's for high-performance workstations or dense server setups, MaxSun's new Arc Pro B60 variant offers a practical solution to the age-old problem of thermal efficiency in compact designs.