A new TSMC packaging technology promises to slash costs by up to 30% while pushing wafer utilization past 90%, but compatibility risks linger for high-end designs.
A fresh driver update has reignited interest in Intel’s aging Arc A770, now delivering competitive performance in s...
The latest Geekbench 6 results reveal a dramatic shift in flagship smartphone performance, with Samsung’s upcoming...
Microsoft’s subscription service adds two major RPGs—one a legendary open-world epic, the other a gritty medieval d...
A compact, high-value AMD Ryzen mini-PC now drops to $324, offering external GPU support, 8K display scaling, and d...
Unity’s CEO reveals plans to launch an AI tool at GDC that claims to generate full casual games from text prompts—y...
The quirky cat-breeding roguelike Mewgenics has shattered sales projections, hitting 1 million copies in just one w...
From Atlus’ boldest RPG yet to beloved Persona remakes, Sega’s current sale offers a rare chance to dive into some...
NVIDIA’s RTX 5090 and RTX 5080 lead a 15% global GPU price spike, with GDDR7 VRAM models seeing the steepest increa...
AMD’s next-gen Instinct MI455X, designed to challenge NVIDIA’s rack-scale AI systems, is facing production delays w...
The Taiwanese chipmaker is reducing second-half bonuses for 12,000 employees as DRAM shortages threaten its smartph...
