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The latest JEDEC LPDDR6 standard introduces 512 GB capacities and SOCAMM2 modules, targeting high-performance AI wo...

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Apex Manifold 360: Precision, Lighting, and a Cleaner Loop

The new Apex Manifold 360 redefines custom water-cooling with four chambers, eight G1/4 ports, and integrated aRGB...

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TSMC's 2029 Roadmap: A13 and A12 Nodes Avoid ASML's Highest-Cost EUV Tools

TSMC's latest process nodes for 2029 aim to bypass the most expensive EUV tools from ASML, signaling a shift in sem...

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Intel's 14A Node: A Narrow but Strategic Lead in Advanced Chipmaking

The 14A process node, built at Intel's TeraFab facility, delivers incremental gains over 18A while positioning the...

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Sony’s PC Port Strategy Under Scrutiny: A Closer Look at the Engineering and Market Dynamics

A former PlayStation executive argues that PC ports are a cost-effective strategy for Sony, helping recoup developm...

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ASUS AI Inference Platform: A New Standard for Balanced Enterprise AI

The ASUS AI Inference Platform introduces a modular, thermally efficient framework for enterprise AI workloads, add...

Apr 22, 20262 min readAI

Rambus SOCAMM2: A Modular Shift in AI Server Memory

The Rambus SOCAMM2 chipset introduces a new era of serviceable, LPDDR5X-based memory modules for AI servers, promis...

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New GPU Boosts Efficiency by 20%, But Thermal Hurdles Remain

A fresh GPU generation delivers a 20% efficiency leap, but thermal management and an unclear long-term vision may l...

Apr 22, 20262 min readPC Components

SK hynix’s 1Q26 performance: a look at the memory market’s shifting tides

The latest quarterly results from SK hynix reveal a memory market in transition, with DRAM prices stabilizing after...

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ASUS ROG Zephyrus Duo and G-series laptops push performance boundaries with premium pricing

The ASUS ROG Zephyrus Duo, G14, and G16 laptops combine high-end GPUs and CPUs with advanced displays, targeting cr...