A new milestone in Intel's advanced packaging technology signals a shift toward higher-volume foundry production, with implications for PC builders and workload optimization.
The latest JEDEC LPDDR6 standard introduces 512 GB capacities and SOCAMM2 modules, targeting high-performance AI wo...
The new Apex Manifold 360 redefines custom water-cooling with four chambers, eight G1/4 ports, and integrated aRGB...
TSMC's latest process nodes for 2029 aim to bypass the most expensive EUV tools from ASML, signaling a shift in sem...
The 14A process node, built at Intel's TeraFab facility, delivers incremental gains over 18A while positioning the...
A former PlayStation executive argues that PC ports are a cost-effective strategy for Sony, helping recoup developm...
The ASUS AI Inference Platform introduces a modular, thermally efficient framework for enterprise AI workloads, add...
The Rambus SOCAMM2 chipset introduces a new era of serviceable, LPDDR5X-based memory modules for AI servers, promis...
A fresh GPU generation delivers a 20% efficiency leap, but thermal management and an unclear long-term vision may l...
The latest quarterly results from SK hynix reveal a memory market in transition, with DRAM prices stabilizing after...
The ASUS ROG Zephyrus Duo, G14, and G16 laptops combine high-end GPUs and CPUs with advanced displays, targeting cr...